Technologist, Packaging Engineering

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements. Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross‑functional engineering teams, global factories, and key stakeholders. Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost‑effective high‑volume introduction of new package designs and advanced assembly processes. Partner with Packaging R&D organizations worldwide to define, develop, and qualify next‑generation and emerging packaging technologies in alignment with long‑term business strategy and product roadmaps Drive enterprise‑level assembly yield improvement initiatives and package cost‑reduction programs, establishing best practices and measurable performance targets across supported product lines. Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions. Lead new products through the transition from low‑volume to high‑volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high‑volume production. Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. REQUIRED: Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines. Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout Additional expertise in die attach, wire bonding, wafer thinning, and molding processes is a plus Experience with machine learning and data analytics utilizing AI technologies SKILLS: Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams. Demonstrated experience mentoring or managing junior engineers is a plus Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies Familiarity with industry benchmarking trends and packaging technology roadmap development Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment