Senior Mechanical Engineer (packaging and integration)

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us. Group/Division With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The RAPID division is the world leading provider of reticle inspection solutions for the semiconductor industry. The company provides inspection solutions to both the mask shops and the semiconductor fabs to ensure that lithography yields are consistently high thus enabling cost-effective manufacturing. Job Description/Preferred Qualifications KLA Rapid Division is seeking a Senior Mechanical Engineer , responsible for the mechanical design and integration of advanced semiconductor inspection systems, including EUV actinic defect inspection platforms . This role focuses on system-level packaging, facility integration, and infrastructure design in ultra-high vacuum (UHV) environments. The engineer will work cross-functionally to deliver robust, manufacturable, and serviceable solutions for complex tool architectures. Key Responsibilities Lead the mechanical packaging and integration of subsystem infrastructure, including: Electrical cabinets and power distribution systems Electrical interconnects and cable routing Gas, water, and vacuum distribution systems Develop and optimize routing strategies for cables, gas lines, and fluid systems to meet serviceability, manufacturability, and cost targets Define and support fab and sub-fab layouts , including facility hook-ups and installation planning Design acoustic, vibration, and thermal enclosures for precision equipment Perform and support thermal, structural, and vibration analysis to ensure system performance Create and maintain engineering documentation, including: P&IDs System layouts and assembly drawings Interface control documentation Drive cross-functional collaboration with electrical, systems, manufacturing, and field teams Support design reviews, risk assessments, and structured problem-solving efforts (RCCA/8D) Interface with suppliers and internal stakeholders to ensure schedule and quality execution Minimum Qualifications Bachelor’s degree in Mechanical Engineering or related field 5+ years of experience in semiconductor capital equipment or similar complex systems Experience designing and integrating systems in UHV or cleanroom environments Required Technical Skills Proficiency in PTC Creo (3D CAD, assemblies, detailing) Experience with PDM/PLM systems (e.g., Windchill) Strong understanding of: P&IDs and fluid system design Electrical cabinet packaging and power distribution Gas, water, and vacuum systems integration Experience with thermal and structural analysis methodologies Expertise in cable and tubing routing in highly constrained environments Preferred Qualifications Familiarity with semiconductor fab infrastructure and facility integration Knowledge of vibration isolation and acoustic design techniques Experience with SEMI standards (S2, S8, S10) Core Competencies Strong communication and cross-functional collaboration Effective planning and execution in a matrixed environment Creative problem-solving with structured methodologies (e.g., RCCA, 8D) Ability to balance innovative design with practical constraints Scope & Impact Contributes to subsystem and system-level design decisions Works under general direction; independent in execution of assignments Influences cross-functional teams and design outcomes Supports delivery of next-generation EUV inspection platforms Minimum Qualifications Doctorate (Academic) Degree and 0 years related work experience; Master's Level Degree and related work experience of 3 years; Bachelor's Level Degree and related work experience of 5 years Base Pay Range: $117,800.00 - $200,300.00 Annually Primary Location: USA-CA-Milpitas-KLA KLA’s total rewards package for employees may also include participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave. Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level, and location.