Senior PCB Designer

About us One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team. What you'll do As a Senior PCB Designer on the Space Infrastructure team, you will design and deliver complex, high‑reliability printed circuit boards that enable next‑generation space systems and ground infrastructure.  Daily tasks will involve utilizing Mentor Graphics Xpedition layout tools, including CES, to complete your designs.  Your design work will follow IPC standards, as well as company and contract manufacturer DFx guidelines. You will own PCB layout from early architectural trade studies through fabrication release, working closely with hardware, mechanical, manufacturing, and test engineers to translate demanding system requirements into robust, manufacturable designs. This role focuses on multi‑layer, high‑speed, mixed‑signal, and power‑dense boards that operate in challenging environments and support fast development cycles. You will help set design standards, improve workflows, and raise the overall quality and efficiency of PCB development across the organization. The day-to-day Produce PCB layouts utilizing Mentor Graphics Xpedition. Own PCB layout for complex designs, including component placement, routing, stack‑up definition, and constraint management for digital, analog, RF, and power circuits Design and route high‑layer‑count boards (10+ layers) with controlled impedance, differential pairs, length matching, power integrity, and signal integrity considerations Collaborate closely with electrical, mechanical, RF, thermal, manufacturing, and test engineers during schematic development and design reviews Perform pre‑ and post‑layout SI/PI analysis, EMI/EMC risk mitigation, and layout trade studies to de‑risk designs early Generate and release complete fabrication and assembly deliverables (Gerber, ODB++, IPC‑2581, drill files, stack‑ups, drawings, and assembly outputs) Apply DFM/DFA/DFT best practices, incorporating feedback from fabrication and assembly partners to improve yield, cost, and schedule Create, validate, and maintain symbols, footprints, and 3D models, and work with libraries to ensure accuracy and reuse Support prototype bring‑up, debug, and iteration by working alongside hardware and test teams Help define and improve PCB design standards, constraints, and workflows across the Space Infrastructure organization Mentor junior designers and contribute to raising the technical bar for layout quality and execution speed What you'll need Associate's degree in electrical engineering or equivalent professional experience 5 - 8 years of professional PCB layout experience, including ownership of complex, multilayer designs 5+ years of direct experience using Mentor Xpedition and CES. Schematic capture experience. Demonstrated experience with high‑speed digital, mixed‑signal, and power electronics layouts Strong understanding of signal integrity, power integrity, EMI/EMC, and manufacturability Experience producing fabrication and assembly packages and working directly with board houses and assemblers Ability to visualize component placement, routing strategies, and mechanical integration early in the design process Strong communication skills and comfort working in fast‑paced, cross‑functional engineering environments Ability to travel up to 10% US Citizenship required What will help you on the job Bachelor’s degree in any engineering discipline. Multi-layer Flex and Rigid-flex circuits experience. Complex Multi-layer PWB utilizing high-speed materials, featuring microstrip, strip line, and differential routing, controlled impedance, mix of low-noise RF/analog circuitry. Digital designs with various pin counts and fine-pitch BGAs, RF transmission lines, matched lengths, and delay control lengths. Experience with JTAG, RGMI, DSP, DDR, LVDS, SERDES, and Ethernet design. RF layout development with partitioning of circuits utilizing shields, specific mounting, and grounding requirements. All design criteria defined by engineering specifications. Knowledgeable with hierarchical schematics and layout reuse schemes is a plus. Familiarity with SI/PI simulation tools, constraint‑driven design, and automation or scripting Experience supporting rapid development cycles, prototype iteration, and production ramp‑up Exposure to space, aerospace, automotive, or other high‑reliability hardware environments A practical, detail‑oriented mindset with a bias toward clean layouts, fast iteration, and manufacturable solutions #LI-GS1 Salary range $99,500.00 - $157,000.00 / annually. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $123,500.00- $185,500.00/ annually At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat’s comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits. EEO Statement Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, na