Senior Principal Engineer, Chip Lead, Photonic Fabric Chiplet

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.  Your Team, Your Impact As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. The Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions. The Photonic Fabric™ includes optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies. This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. What You Can Expect Marvell Technology is   seeking   a highly experienced   Chip   Lead  to own the   end ‑ to ‑ end   development of a heterogeneous photonic chiplet   comprising   a   high ‑ speed   electrical IC with advanced analog SERDES  and a   photonic integrated circuit (PIC) , brought together using   advanced   co ‑ packaged   technologies .   This role requires technical breadth across   mixed ‑ signal   SoC design, photonic integration,   chiplet ‑ style   partitioning,   firmware   and   package ‑ level   co ‑ design , along with proven leadership delivering complex silicon from concept through   silicon   bring ‑ up , ATE, and system validation .   The ideal candidate has shipped   high ‑ speed   I/O and/or optical products , understands   electrical ‑ optical   tradeoffs, and can act as the single technical owner across die, package, optics, and system boundaries.   Key Responsibilities   Own the   end ‑ to ‑ end product   design   s panning   Electrical IC , Photonic IC,   f irmware stack ,   and   a dvanced packaging   design.   Lead   micro ‑ architecture   and RTL development  for   the Electrical IC   that   can   include   high speed SERDES   and digital subsystems with   internally developed   IPs   and   industry standard   external I Ps such as   UALink , UCIe ,   etc.   Collaborate   with   v erification team to   ensure robust functional and per formance verification   spanning   digital RTL,   AMS   and electrical-optical interface s .   Work closely   with   physical design   and packaging teams on   floorplanning , physical implementation, timing,   power, and   physical verifi cation closure.   Partner   with DFT experts to   d rive   DFT strategy  for digital, analog SERDES, and system ‑ level testability.   Partner   with   p hotonics   team   to define   PIC architecture , interfaces, and control schemes ,   and   e nsure robust   electrical -optical   co ‑ design .   Collaborate   with test engineering to drive   ATE enablement , test program development, and debug.   Lead   cross-functional team to   complete   system ‑ level validation , including boards, optics, firmware, and software interaction.   Drive  root ‑ cause analysis across silicon, package, optics, and system domains .   Mentor   and develop   senior engineers and influence   cross functional teams   across disciplines   in a matrixed environment .   Identify   and   communicate technical status, risks, and tradeoffs to engineering and product leadership.   What We're Looking For Bachelor’s degree in   Computer Science ,   Electrical Engineering ,   or   related fields and 15+   years of related   professional experience   OR   Master’s degree   /   PhD   in   Computer Science,   Electrical   Engineering   or   related fields with   8 -12   years of experience.   15+ years of experience in   ASIC / SoC development   with   end ‑ to ‑ end   chip ownership .   Strong experience across   Micro ‑ architecture   and RTL desig n,   h igh ‑ speed   analog SERDE S ,   p hysical design and   sign ‑ off ,   DFT and manufacturing test ,   a dvanced packaging and   chiplet ‑ style   integration ,   p ost ‑ silicon   bring ‑ up , ATE, and system validation .   Ability to   clearly articulate architectural and   implementation   tradeoffs  across performance, power, area, yield, cost, schedule, and risk.     Strong   track record   of   driving alignment   across   cross ‑ functional   teams with differing viewpoints in a matrixed environment   and drive solutions to tough   engineering problems across the product stack.   Excellent written and verbal communication skills, including leading technical reviews and communicating status, risks, and decisions to engineering and product leadership   at the executive level .   While deep   expertise   across all domains is not expecte d, t he ideal candidate will   demonstrate   the   maturity and   technical judgment to   foster a culture of cross -domain collabor ation   and   deal with conflicts in a