Sr. Principal Assembly & Test Engineer – SMT (Surface Mount Technology), Probe Card Manufacturing

Forming Our Future together FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America. Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter. Shift: The regular hours for this position are day shift. Job Description: The Sr. Principal Assembly & Test (A&T) SMT Engineer   is responsible for   owning,   optimizing , and supporting Surface Mount Technology processes used in probe card manufacturing. This role ensures   high quality   PCB assembly, stable process capability, and predictable output across   pick and place , reflow, inspection, and associated upstream/downstream steps. The engineer provides technical leadership for SMT line performance, defect reduction, equipment improvements, and   cross functional   integration with plating, lithography, mechanical assembly, and electrical test teams.   Key Responsibilities: SMT Process Engineering   Develop, qualify, and maintain SMT processes, solder paste   selection ,   solder paste injection and inspection,   reflow profiling, and placement parameters.   Own recipe creation and optimization for   high density   advanced probe card PCBs.   Drive process capability improvements (Cp/ Cpk ) and ensure stable production performance.   Equipment Ownership   Provide daily engineering support for SMT equipment such as:    Stencil printer   Pick and place   machine   Reflow oven   SPI (Solder Paste Inspection)   Lead troubleshooting and root cause analysis for equipment failures, misplacements, reflow defects, or   inspection   inaccuracies.   Define   and   maintain   PM schedules, calibration, and spare parts strategies.   Quality & Yield Improvement   Monitor and analyze yield,   defect   Paretos , and SPC trends to   identify   systemic issues.   Lead   DfX   (Design for Assembly, Design for Manufacturability) discussions with design engineering.   Implement corrective actions and sustainable process controls for solder bridging, opens, voiding, tombstoning, and wetting failures.   Manufacturing Support   Support production technicians with process deviations, equipment issues, and new product introductions.   Develop documentation including WI/SOPs, process parameters, machine setup sheets, and inspection criteria.   Drive cycle time reduction, throughput improvements, and operator training.   Cross Functional   Collaboration   Work closely with:    Plating & Metallization Engineers   Photolithography Engineers   Mechanical/Assembly Engineering   Electrical Test Engineering (FPT, PRVX4)   Supply Chain & Quality   Provide engineering support during prototype builds and   customer specific   configurations.   Continuous Improvement   Lead Lean/6σ initiatives to reduce waste, improve flow, and enhance process robustness.   Evaluate and introduce new materials (solder paste, adhesives, fluxes) and improved stencil/hardware designs.   Participate in equipment justification and capital project planning.   Preferred   Experiences   and Backgrounds: Bachelor’s degree in Electrical Engineering , Mechanical Engineering, Manufacturing Engineering, Materials Science, or related   field .   3–7 years of SMT or PCB assembly experience (semiconductor, PCBA, or electronics assembly preferred).   Strong understanding of solder paste behavior, reflow principles,   component   placement strategies, and defect mechanisms.   Handson experience with SMT equipment and inspection systems (SPI, AOI).   Proficiency   with SPC, FMEA, DOE, and root cause problem solving.   Experience in probe   card , semiconductor test hardware, or   high precision   PCB manufacturing.   Familiarity with   high density   BGAs,   fine pitch   components, and   micro assembly .   Knowledge of CAM/EDA data for stencil/paste aperture optimization.   Lean/6σ Green Belt or Black Belt certification.   Experience with MES systems and factory automation.   Skills: Communication, Continuous Improvement, Cross-Functional Teamwork, Manufacturing Support, Operational Excellence, Structured Problem Solving, Taking Ownership, Troubleshooting, Working in a Fast-Paced Environment, Writing Documentation Education & Experience: Minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree; or a PhD with 3 years experience; or equivalent experience | Required Equal Employment Opportunity Statement FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation. For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND,