Process Engineer
Mesh Optical Technologies · California
📍 Gardena, CA💰 $90,000via greenhousePosted 2026-06-16
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PROCESS ENGINEER
Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.
Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.
RESPONSIBILITIES
Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
Design production processes from the lab bench through proof of concept and production ramp
Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield
QUALIFICATIONS
B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field
Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
Willingness to work extended hours and weekends as needed
PREFERRED EXPERIENCE
Direct experience qualifying or operating production equipment in a high-volume production environment
Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
Familiarity with statistical process control and root cause analysis methods
2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
COMPENSATION AND BENEFITS:
Pay range:
Process Engineer: $90,000.00 - $140,000.00/per year
Title and base salary are determined on a case by case basis commensurate with experience and merit.
In addition to base salary, compensation for this role includes:
Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
401(k) retirement plan access.
Relocation assistance to sunny Los Angeles.
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